3D, 2D fully automatic online (offline) AOI. Inspection after printing, inspection after placement, inspection after plug-in, inspection after reflow oven, inspection after wave soldering, etc. SMT surface assembly whole process inspection equipment.
3D and 2D inspection of appearance defects in manufacturing process. Detection of wafer surface defects, debris, cracks, cutting cracks, etc.; packaging process (DB, WB) chip defects, poor glue, poor bonding wires, poor solder balls, and debris and other defects.
LED lamp bead packaging process fully automatic 2D, 3D appearance inspection, bad sorting, data statistics. Detection of LED chips, soldering, excess glue and less glue, gold wire leakage, debris and dimensional errors.
Complete equipment manufacturing, mechanical structure and electrical design support, sheet metal manufacturing/metal cutting processing, installation and commissioning and on-site service.
UL certified power cord, standard interface data transmission cable, signal and electrical connection harness,Various customized interconnection harnesses