金沙集团186cc(澳门)成色有限公司

Product
- 3D AOI
  
  Perfect combination of 2D and 3D technology
  
  Edge
- 3D SPI
  
  Perfect application of 3D high-precision contour measurement technology
  
  Mirage
- FPC AOI
  
  A unique detection algorithm developed according to the characteristics of the FPC itself
  
  SF211
- 2D AOI
  
  High speed, high precision
  
  Twins
  
  LI-6000D
  
  LI-5000
  
  LI-3000DP
  
  MI-3000
  
  XI-2000
  
  LD-5000
  
  MD-2000
  
  XD-2000
- LED AOI
  
  Detection speed reaches 3000mm²/s
  
  LED-2000
  
  LED-1000
- Laser marking equipment
  
  machine vision technology ensures the accuracy and speed of marking
  
  LMUV-1000
  
  Spark-CD
  
  LMF-2000
  
  LMC-3000
  
  SHINE-C1
  
  SHINE-F1
- High-speed dispensing equipment
  
  Proprietary highly integrated induction calibration system
- Selective wave soldering
  
  The parameters of each solder joint can be
  
  VoLcano
- Optional accessories
  
  AOI corresponding accessories
  
  Real-time remote debugging
  
  Repair terminal
  
  Centralized management
  
  SPC
  
  Three-point comparative analysis
  
  Bar code
Industry Application
Investor Relations
News
Recruitment

3D SPI

Perfect application of 3D high-precision contour measurement technology

Dual light source

Dual light source digital projection detection technology, no shadows, high precision
Stop-and-go dynamic acquisition

Intelligent optimization of inspection route, full-page 3D image display, 100% defect coverage
Multi-frequency digital grating projection technology

The detection range is effectively improved, and the height error of the substrate warping is eliminated through the plane fitting algorithm.
SPC system

The quality trend distribution can be provided graphically, and the defects can be predicted in advance. And find out the potential factors causing the trend in advance, adjust in time, and control the spread of the trend.

All-round three-dimensional solder paste status display of the entire board, which really intuitively reflects the printing defect status of the entire board solder paste

In 3D state, solder paste status display

Missing print, less tin

product list

Mirage

Device type: online automatic 3D SPI

Special features: 3D high-precision contour measurement technology perfect application
Applicable substrate: 50mm x 70mm-510mm x 460mm
Substrate thickness: 0.6mm-6.0mm Resolution: 10μm-15μm (adjustable)
Height measurement accuracy: 1μm
Dimensions:W1080 x D1300 x H1850(mm)
Weight: 740KG