金沙集团186cc(澳门)成色有限公司

Product
- 3D AOI
  
  Perfect combination of 2D and 3D technology
  
  Edge
- 3D SPI
  
  Perfect application of 3D high-precision contour measurement technology
  
  Mirage
- FPC AOI
  
  A unique detection algorithm developed according to the characteristics of the FPC itself
  
  SF211
- 2D AOI
  
  High speed, high precision
  
  Twins
  
  LI-6000D
  
  LI-5000
  
  LI-3000DP
  
  MI-3000
  
  XI-2000
  
  LD-5000
  
  MD-2000
  
  XD-2000
- LED AOI
  
  Detection speed reaches 3000mm²/s
  
  LED-2000
  
  LED-1000
- Laser marking equipment
  
  machine vision technology ensures the accuracy and speed of marking
  
  LMUV-1000
  
  Spark-CD
  
  LMF-2000
  
  LMC-3000
  
  SHINE-C1
  
  SHINE-F1
- High-speed dispensing equipment
  
  Proprietary highly integrated induction calibration system
- Selective wave soldering
  
  The parameters of each solder joint can be
  
  VoLcano
- Optional accessories
  
  AOI corresponding accessories
  
  Real-time remote debugging
  
  Repair terminal
  
  Centralized management
  
  SPC
  
  Three-point comparative analysis
  
  Bar code
Industry Application
Investor Relations
News
Recruitment

LED AOI

Detection speed reaches 3000mm²/s.

Standardized LED automatic optical inspection equipment.

It can perform appearance defect imaging on the front and back of the LED.

Dual track fast acquisition

The equipment adopts full-automatic loading and unloading and double-track quick image acquisition. It is inspected by machine vision and automatically rejects defective LED chips according to the inspection results.
Imaging

Can perform appearance defect imaging on the front and back of the LED
protection

Ion static elimination technology ensures the protection of materials during transmission, imaging, and poor processing
Ink mark

Use imported inkjet equipment to mark the detected appearance defect products with bad ink
Connection module

Connecting module with process equipment after LED packaging process

product list

LED-2000

Equipment name: Online automatic Chip LED packaging appearance inspection machine

Bracket size: 510mm X 460mm (without inkjet device)
460mm X 350mm (including inkjet device)
Resolution: 6um ~ 10um (adjustable)
Dimensions: W1000mm X D1170mm X H1800mm
Dimensions: W2200 x D1520 x H1750 mm
Weight: 734KG

LED-1000

Equipment type: online automatic TOP LED packaging appearance inspection machine

Bracket size: 40mm x 20mm-90mm x 160mm (dual track)
Bracket thickness: 0.1mm or more
Resolution: 5μm-12μm (adjustable)
Dimensions: W2200 x D1520 x H1750 mm
Weight: 1600KG